Fibre integrated circuits by a multilayered spiral architecture

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2026-01-21 17:16:07 - Μετάφραση -

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Nature, Published online: 21 January 2026; doi:10.1038/s41586-025-09974-0Fibre integrated circuits created by first preparing circuitry on extremely thin and flexible substrates and then mechanically rolling them up demonstrate microdevice density reaching 100,000 transistors per centimetre and excellent stability under harsh service conditions.

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